Glossary entry (derived from question below)
German term or phrase:
Ankontaktierung
English translation:
wires are bonded to the contact pads
Added to glossary by
Jonathan Whiteley
Jan 3, 2007 23:56
17 yrs ago
German term
United States
Your translator
Native in: English (Variant: US) 
Works in: German to English, French to English, Spanish to English
Ankontaktierung
German to English
Tech/Engineering
Electronics / Elect Eng
PCB design
Nach dem Verpressprozess erfolgt die Ankontaktierung der Anschlusspads des Umverdrahtungsträgerelements.
In a previous sentence there is a distinction made between Ankontaktierung and Durchkontaktierung. See below.
Nachdem die Kupferhülsen der An- bzw. Durchkontaktierung hergestellt sind, erfolgt die Strukturierung der Außenlagen des Multilayers mit herkömmlichen Verfahre
In a previous sentence there is a distinction made between Ankontaktierung and Durchkontaktierung. See below.
Nachdem die Kupferhülsen der An- bzw. Durchkontaktierung hergestellt sind, erfolgt die Strukturierung der Außenlagen des Multilayers mit herkömmlichen Verfahre
Proposed translations
(English)
| 4 | wires are bonded to the contact pads |
Edward L. Crosby III
|
| 4 | comment |
Ken Cox
|
| 3 | (hole) plating (hier) |
Bernhard Sulzer
|
Proposed translations
9 hrs
Edward L. Crosby III
Native in English
Works in field
The best never rest!
Native in: English 
Works in: German to English, Spanish to English, English to German, and 3 more.
Related KudoZ points
:
8
Selected
wires are bonded to the contact pads
If these are PCBs, then I think they're referring to the attachment of leads to the individual contact pads around the IC. "Durchkontaktierung" would be "through-plating", a process used to establish contacts between different levels of multi-level PCBs.
"Fine wires are then bonded between the die pads and PCB pads to configure the desired circuit (see Figure 2). " (http://http://www.devicelink.com/mddi/archive/03/03/001.html...
Any way you do it, "die Ankontaktierung der Anschlußpads erfolgt..." will have to be turned around in the English.
"Fine wires are then bonded between the die pads and PCB pads to configure the desired circuit (see Figure 2). " (http://http://www.devicelink.com/mddi/archive/03/03/001.html...
Any way you do it, "die Ankontaktierung der Anschlußpads erfolgt..." will have to be turned around in the English.
4 KudoZ points awarded for this answer.
Comment: "Thanks for the help"
3 hrs
Bernhard Sulzer
United States
United States
Native in German
Works in field
United States
High quality at a reasonable price
Native in: German
Works in: English to German, German to English, German, and 1 more.
Related KudoZ points
:
12
(hole) plating (hier)
http://www.brockstedt.de/de/pdcn/quality.html
englische und deutsche Versionen
connecting and moulding might fit as well, even contacting -
there are several applications for this term in English - but given the context I suggest "hole plating"
for "Durchkontaktierung" see
http://www.proz.com/kudoz/1155017
englische und deutsche Versionen
connecting and moulding might fit as well, even contacting -
there are several applications for this term in English - but given the context I suggest "hole plating"
for "Durchkontaktierung" see
http://www.proz.com/kudoz/1155017
12 hrs
comment
IMO Bernard's answer is serviceable. You'd need close to a full sentence to render the German into English, and the question is whether this is appropriate in the context.
In a multilayer board, the through-plated holes make contact with various traces (actually pads or lands) in the intermediate layers (possibly but not necessarily including the outer layers), which is the Ankontaktierung aspect, and they interconnect two or more traces on two or more layers, which is the Durchkontaktierung aspect. With a simple two-sided board, the two aspects are practically identical. Through-plated holes in multilayer boards always extend through the full thickness of the laminated board, but they do not necessarily contact (and thus interconnect) traces on all layers.
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Note added at 12 hrs (2007-01-04 12:02:23 GMT)
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sorry, make that Bernhard
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Note added at 12 hrs (2007-01-04 12:06:09 GMT)
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and make it 'in the various layers' instead of ín 'in the intermediate layers' for strict accuracy
In a multilayer board, the through-plated holes make contact with various traces (actually pads or lands) in the intermediate layers (possibly but not necessarily including the outer layers), which is the Ankontaktierung aspect, and they interconnect two or more traces on two or more layers, which is the Durchkontaktierung aspect. With a simple two-sided board, the two aspects are practically identical. Through-plated holes in multilayer boards always extend through the full thickness of the laminated board, but they do not necessarily contact (and thus interconnect) traces on all layers.
--------------------------------------------------
Note added at 12 hrs (2007-01-04 12:02:23 GMT)
--------------------------------------------------
sorry, make that Bernhard
--------------------------------------------------
Note added at 12 hrs (2007-01-04 12:06:09 GMT)
--------------------------------------------------
and make it 'in the various layers' instead of ín 'in the intermediate layers' for strict accuracy
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